铜对双靶共溅制备热电薄膜输运性能的影响
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CAO Li-Li, WANG Yao, DENG Yuan, LUO Bing-Wei, ZHU Wei, SHI Yong-Ming, LIN Zhen
Fig. 2 SEM images of the 00l oriented Bi 0.5 Sb 1.5 Te 3 films a, b Surface morphology and cross-sectional view of Cu-dispersed films sputtered at 5 W; c, d Surface morphology and cross-sectional view of Cu-dispersed films sputtered at 10 W; e, f Surface morphology and cross-sectional view of Cu-dispersed films sputtered at 20 W; g, h Surface morphology and cross-sectional view of Cu-dispersed films sputtered at 40 W