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新型相变材料Ti0.5Sb2Te3刻蚀工艺及其机理研究
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张徐1,2, 刘波1, 宋三年1, 姚栋宁1, 朱敏1,2, 饶峰1, 吴良才1, 宋志棠1, 封松林1 |
Study on Etching Process and Mechanism of New Phase Change Material Ti0.5Sb2Te3
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ZHANG Xu 1,2, LIU Bo 1, SONG San-Nian 1, YAO Dong-Ning 1, ZHU Min 1,2, RAO Feng 1, WU Liang-Cai 1, SONG Zhi-Tang 1, FENG Song-Lin 1
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图3 不同刻蚀腔内气体压强下获得的刻蚀面的SEM照片 Fig. 3 SEM images of surfaces and cross-sections of TST features after etching at different pressures a 2.66 Pa; b 5.32 Pa; c 7.98 Pa; d 13.3 Pa; e 15.96 Pa CF 4 : 26%; Power: 300 W; Etching time: 90 s; Thickness of TST: 200 nm |
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