反应烧结碳化硅的磨削特征
姚旺1, 张宇民2, 韩杰才2, 周玉锋2

Grinding Characteristics of Reaction Bonded Silicon Carbide
YAO Wang1, ZHANG Yu-Min2, HAN Jie-Cai2, ZHOU Yu-Feng2
图2 不同轴向进给速度磨削表面的SEM照片
Fig. 2 SEM images of surfaces ground at different down feeds a 0.9 #cod#x003bc;ms, brittle fracture area; b 0.9 #cod#x003bc;ms, furrow area; c 1.35 #cod#x003bc;ms, furrow area