Template Preparation Techniques and Application of Hollow Micro- or Nano-Particles

Abstract

Abstract: The preparation techniques of hollow micro- or nano-particles by using either hard templates or soft templates were reviewed in terms of fabrication mechanism and structure controllability, and with
emphasis on the recent progress of such preparation methods as layer-by-layer assembly, surface chemical reaction and coprecipitation, micro-encapsulation methods. The relationship between the
structure and the performance, as well as the potential applications in areas of materials science, biomedicine, catalysts etc of the hollow micro- or nano-particles were also discussed.

Key words: hollow micro- or nano-particles, templates, layer-by-layer assembly, surface reaction and coprecipitation

CLC Number:

O641
TB383

HUANG Zhong-Mei,GUAN Jian-Guo,GAN Zhi-Ping,WANG Zhen-Jie. Template Preparation Techniques and Application of Hollow Micro- or Nano-Particles[J]. Journal of Inorganic Materials.

References

[1] 官建国, 邓惠勇, 王维, 等. 化学进展, 2004, 16(3): 327--334.
[2] Caruso F. Advanced Materials, 2001, 13(1): 11--21.
[3] Guan J G, Wang W, Gong R Z, et al. Langmuir, 2002, 18(11): 4198--4204.
[4] Caruso F, Trau D, Mohwald H, et al. Langmuir, 2000, 16: 1485--1488.
[5] Kim S W, Kim M, Lee W Y, et al. J. Am. Chem. Soc., 2002, 124: 7642--7643.
[6] 任平, 官建国, 甘治平, 等. 材料导报, 2004, 18: 200--203.
[7] Caruso F, Caruso R A, Mohald H. Science, 1998, 282(6): 1111--1114.
[8] 宋彩霞, 王德宝, 古国华, 等. 材料导报, 2003, 7: 32--34.
[9] 刘鹏, 田军, 刘维民, 等. 化学进展, 2004, 16(1): 15--20.
[10] Caruso R A, Susha A, Caruso F. Chem. Mater., 2001, 13: 400--409.
[11] 杨晓玲, 朱以华, 朱孟钦, 等(YANG Xiao-Ling, et al). 无机材料学报(Journal of Inorganic Materials), 2003, 18(6): 1293--1298.
[12] Caruso F, Spasova M, Susha Andrei, et al. Chem Mater., 2001, 13: 109--116.
[13] Gittins D I, Caruso F. J. Phys. Chem. B., 2001, 105: 6846--6852.
[14] Valtchev V. Chem. Mater., 2002, 14: 4371--4377.
[15] 王德举, 唐颐, 董安钢, 等. 化学学报, 2003, 9: 1425--1429.
[16] Yin Y, Lu Y, Gates B, et al. Chem. Mater., 2001, 13: 1146--1148.
[17] Shiho H, Kawahashi N. Colloid Polym Sci., 2000, 278: 270--274.
[18] Yin J L, Qian X F, Yin J, et al. Inorganic Chemistry Communications, 2003, 6(7): 942--945.
[19] Mandal T K, Flemming M S, Walt D R. Chem. Mater., 2000, 12: 3481--3487.
[20] Arnout I. Langmuir, 2001, 17: 3579--3585.
[21] Mandal T K, Fleming M S, Walt D R. Chem. Mater., 2000, 12: 3481--3487.
[22] McKelvey C A, Kaler E W, Zasadzinski J A, et al. Langmuir, 2000, 16: 8285--8290.
[23] Hubert D H W, Jung M, German A L. Adv. Mater., 2000, 12: 1291--1294.
[24] Naik S P, Chiang A S T, Thompson R W, et al. Chem. Mater., 2003, 15: 787--792.
[25] 梁文平. 乳状液科学与技术基础, 第一版. 北京: 科学出版社, 2001. 10.
[26] Li Y, Shi J. Hua Z, et al. Nano Lett., 2003, 3: 609--612.
[27] Jang J, Ha H. Langmuir, 2002, 18: 56: 5613-5618.
[28] Sato Y, Kawashima Y, Takeuchi H, et al. Journal of Controlled Release, 2003, 1(93): 39--47.
[29] Murthy V S, Cha J N, Stucky G D, et al. J. Am. Chem. Soc., 2004, 126: 5292--5299.
[30] Wong M S, Cha J N, Choi K S, et al. Nano Lett., 2002, 2: 583--587.
[31] Cha J N, Bartl M H, Wong M S, et al. Nano Lett., 2003, 3: 907--911.
[32] Cha J N, Birkedal H, Euliss L E, et al. J. Am. Chem. Soc., 2003, 125: 8285--8289.
[33] Ma Y, Qi L, Ma J, et al. Langmuir, 2003, 19: 9079--9085.
[34] Ma Y, Qi L, Ma J, et al. Langmuir, 2003, 19: 4040--4046.
[35] 沈志刚, 王明珠, 麻树林, 等．中国塑料, 2002, 16(5): 55--57.
[36] 李报厚, 张登君, 张冠东, 等. 功能材料, 1997, 28: 518--521.
[37] Caruso F, Shi X Y, Caruso R A, et al. Adv. Mater., 2001, 13(10): 740--744.
[38] 毛倩瑾, 于彩霞, 王群, 等. 北京工业大学学报, 2003, (1): 108--111.
[39] Graf C, Blaaderen A B. J. Am. Chem. Soc., 2002, 18: 524--534.
[40] Tamai H, Ikeya T, Nishiyama F, et al. J. Mater. Sci., 2000, 35: 4945--4953.
[41] Antipov A A, Sukhorukov G B, Fedutik Y A, et al . Langmuir, 2002, 18: 6687--6693.
[42] Gill I, Ballesteros A. J. Am. Chem. Soc., 1998, 120: 8587--8589.
[43] Carosu F, Trau D, Mohwald H, et al. Langmuir, 2000, 16: 1485--1488.
[44] 邱龙会, 唐永建, 魏芸, 等. 中国科学(A)辑. 2001, 6: 539--544.
[45] Liu S Y, Weaver J V M, Save M, et al. Langmuir, 2002, 18: 8350--8357.