Journal of Inorganic Materials ›› 2021, Vol. 36 ›› Issue (6): 570-578.DOI: 10.15541/jim20200361

Special Issue: 能源材料论文精选(2021) 【虚拟专辑】太阳能电池(2020~2021) 【能源环境】太阳能电池

• REVIEW • Previous Articles     Next Articles

Texturing Technology on Multicrystalline Silicon Wafer by Metal-catalyzed Chemical Etching: a Review

WU Xiaowei1,2(), LI Jiayan1,2()   

  1. 1. Key Laboratory of Materials Modification by Laser, Ion, and Electron Beams, Dalian University of Technology, Dalian 116024, China
    2. School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
  • Received:2020-06-30 Revised:2020-08-30 Published:2021-06-20 Online:2020-10-10
  • Contact: LI Jiayan, associate professor. E-mail: lijiayan@dlut.edu.cn
  • About author:WU Xiaowei(1991-), male, PhD candidate. E-mail: wuxiaowei261@163.com
  • Supported by:
    National Natural Science Foundation of China(51574057)

Abstract:

In the production process of multicrystalline silicon solar cells, diamond wire sawn (DWS) cutting technology attracts wide attention because of its advantages of high cutting speed, high precision and less loss of raw materials. But the traditional acid etching technology cannot match the shallow damage layer formed on the surface of diamond wire sawn cut multicrystalline silicon wafer to make the texture surface. On the contrary, the metal-catalyzed chemical etching method owns the advantages of simple operation, controllable structure and easy to form the structure with high aspect ratio, indicating a wide range of application on diamond wire sawn cut multicrystalline silicon wafer. This paper systematically summarizes the work of the etching mechanisms and the structures of textures by different metal catalysts in the process of making texture surface, and deeply discusses the single and composite catalytic etching process of Ag and Cu, the structure of texture surface, and the performance of solar cells. Finally, the problems of metal-catalyzed chemical etching on the surface of diamond wire sawn cut multicrystalline silicon are analyzed, and their future research directions are prospected.

Key words: diamond wire sawn cut, multicrystalline silicon, metal-catalyzed chemical etching, texturization, review

CLC Number: