Journal of Inorganic Materials ›› 2014, Vol. 29 ›› Issue (6): 639-644.DOI: 10.3724/SP.J.1077.2014.13416

• Orginal Article • Previous Articles     Next Articles

Structure of Antireflective Films with Si-O-P Bonds and Impact Factors on Its Performance

WANG Yan, WANG Hong-Ning, CHEN Ruo-Yu   

  1. (School of Petroleum & Chemical, Changzhou University, Changzhou 213164, China)
  • Received:2013-08-13 Revised:2013-10-29 Published:2014-06-20 Online:2014-05-27
  • About author:WANG Yan. E-mail: wangyan1989816@126.com

Abstract:

An antireflective (AR) film was successfully prepared by dip-coating on silica glass substrate. During the preparation, aqueous colloidal silica (ACS) was used as silica source, orthophosphoric acid as adhesion promoting agent and hydrogen peroxide as activating agent. The structure, formation mechanism and performance of the film were investigated by FTIR, XRD, FESEM, TEM and AFM. The hydrogen peroxide in silica sol repairs the surface Si-O- bonds of colloidal silica particles greatly. As a result, their stabilities and reaction activities are improved. During the heat-treatment of the film, the orthophosphoric acid is firstly transformed into the chain of metaphosphoric acid and subsequently reacted with surface Si-OH from colloidal silica particles and the substrate, resulting in the formation of the numerous Si-O-P cross-linkings and the stable silicophosphate gel structure. When molar ratio of H3PO4: H2O2: EtOH: SiO2 is 0.49: 0.52: 30: 1, the average transmittance of the film in the visible light is 98%, and the pencil hardness grade reaches 6H.

Key words: aqueous colloidal silica, orthophosphoric acid, hydrogen peroxide, Si-O-P bonds, antireflective films

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