Journal of Inorganic Materials ›› 2013, Vol. 28 ›› Issue (11): 1270-1274.DOI: 10.3724/SP.J.1077.2013.13113

• Research Letter • Previous Articles    

NiO-doped CaCu3Ti4O12 Thin Film by Sol-Gel Method

XU Dong1,2, SONG Qi1, ZHANG Ke1, XU Hong-Xing1, YANG Yong-Tao1, YU Ren-Hong3   

  1. (1. School of Material Science and Engineering, Jiangsu University, Zhenjiang 212013, China; 2. State key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China; 3 Changzhou Ming Errui Ceramics Co., Ltd., Changzhou 213102, China)
  • Received:2013-03-04 Revised:2013-04-01 Published:2013-11-20 Online:2013-10-18
  • Supported by:

    Specialized Research Fund for the Doctoral Program of Higher Education of China(20123227120021); Natural Science Foundation of Jiangsu Province(BK2012156);?universities Natural Science Research Project of Jiangsu Province (13KJB430006); Opening Project of State key Laboratory of Electronic Thin Films and Integrated Devices(KFJJ201105); Application Program for Basic Research of Changzhou(CJ20125001)

Abstract: Pure CaCu3Ti4O12 (CCTO) thin film and NiO-doped CaCu3-xNixTi4O12 (CCNTO) thin film with x=0.10, 0.20 and 0.30 were prepared by Sol-Gel method. The effects of NiO on the dielectric properties and microstructure revolution of CCTO were studied. The crystalline structure and the surface morphology of the films were markedly influenced by NiO content. AFM images of the CaCu3-xNixTi4O12 samples showed that the grain size of Ni-doped CCTO was smaller than the grain size of CCTO without Ni doping. For the CCNTO thin film(x=0.2), the lowest leakage current was obtained and the minimum value reached 0.564 mA. Meanwhile, the highest threshold voltage and nonlinear coefficient were 81 V/mm and 1.9, respectively. The dielectric constant increased when the doping content of Ni reached a certain level. Besides, the dielectric loss was decreased firstly, and then increased.

Key words: CaCu3Ti4O12, Sol-Gel, electrical properties, microstructure

CLC Number: