Journal of Inorganic Materials ›› 2013, Vol. 28 ›› Issue (2): 201-206.DOI: 10.3724/SP.J.1077.2013.12203

• Orginal Article • Previous Articles     Next Articles

Influence of Substrate Temperature on the Morphology, Composition and Growth Rate of SiC Films Deposited by PECVD

YU Fang-Li1,2, BAI YU2, QIN Yi2, YUE Dong2, LUO Cai-Jun2, YANG Jian-Feng2   

  1. (1. School of Materials Engineering, Yancheng Institute of Technology, Yancheng 224051, China; 2. State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China)
  • Received:2012-04-03 Revised:2012-05-30 Published:2013-02-10 Online:2013-01-23
  • About author:YU Fang-Li. E-mail: yufangli0405@163.com
  • Supported by:
    National Natural Science Foundation of China (51202211, 51202187);Research Fund of Key Laboratory for Advanced Technology in Environmental Protection of Jiangsu Province (AE201013)

Abstract:

SiC films were deposited on the surface of single crystal Si(100) and polycrystalline Cu by plasma enhanced chemical vapor deposition (PECVD). The effect of substrate temperature on the composition, structure and growth rate of as-deposited films was studied by high resolution transmission electron microscope (HRTEM), X-ray photoelectron spectroscope (XPS) and scanning electron microscope (SEM). The results showed that the as-deposited films were amorphous and the growth rate of films decreased with increasing substrate temperature from 60℃ to 500℃. In addition, the growth rate of films deposited on the Si(100) wafer was higher than ones deposited on the polycrystalline Cu under the same deposition conditions. Meanwhile, it was found that the Si/C ratio of films decreased with the increase of substrate temperature. When the substrate temperature was controlled at about 350℃, the Si/C ratio in film was nearly equal to 1:1.

Key words: SiC, PECVD, amorphous film, growth rate, substrate temperature

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