[1] 岳振星,周济(YUE Zhen-Xing, et al). 无机材料学报(Journal of Inorganic Materials), 1999, 14 (3): 375--379. [2] Tummala R R. J. Amer. Ceram. Soc., 1991, 74 (5): 895--908. [3] Chiou Bi-Shiou, Tzeng JYH-Ming, Duh Jeno-Gong. J. Mater. Science: Mater in Electro, 1993, 4: 301--304. [4] Jean Jau-Ho, Tapan K Gupta. IEEE Trans.comp.,packing.manuf.tech., 1994,part B, 17 (2): 228--233. [5] MacDowell J F, Beall G H. Materials Research Society Symposium Proceedings, Advanced Electronic Packing Materials, Barfknecht, A.T.,Partridge, J.P., Chen,C.J., Li,C,-YZ,Eds.; Materials Research Society:Pittsburgh, 1989, 167: 259. [6] Jean Jau-Ho, Shen J I. Jpn.J.App.Phys., 1996, 35 part 1,(7): 3942--3945. [7] Kumta P N, Sriram M A. Journal of Materials Science, 1993, 28 (4): 1097--1106. |