Performance of Al/AlN Substrate

Journal of Inorganic Materials

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Performance of Al/AlN Substrate

PENG Rong; ZHOU He-Ping; NING Xiao-Shan; LIN Yuan-Bo; Xu Wei

The State Key Laboratory of New Ceramic and Fine Processing; Department of Materials Science and Engineering; Tsinghua University; Beijing 100084; China

Received:2001-09-20 Revised:2001-11-09 Published:2002-11-20 Online:2002-11-20

Abstract

Abstract: In this work, by die-casting-bonding process, in 948-1098K and N₂ atmosphere, Al/AlN substrate was produced
successfully. The bonding strength of Al and AlN substrate tested by mechanic testing equipment was more than 15.56MPa; The micorstructure
of Al/AlN interface was investigated by SEM and microscope. The results show that there is nothing produced in the interface of Al/AlN,
the crystal of aluminium grows on the surface of AlN directly, the bonding temperatures have no influence on Al/AlN interface strength.

Key words: bonding, Al, die-casting-bonding, AlN substrates

CLC Number:

TQ174

PENG Rong,ZHOU He-Ping,NING Xiao-Shan,LIN Yuan-Bo,Xu Wei. Performance of Al/AlN Substrate[J]. Journal of Inorganic Materials.

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Performance of Al/AlN Substrate

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