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片式BaTiO3基PTCR注浆成型研究

刘欢; 龚树萍; 陈艳; 郑志平; 周东祥   

  1. 华中科技大学电子科学与技术系 武汉 430074
  • 收稿日期:2003-05-08 修回日期:2003-07-01 出版日期:2004-05-20 网络出版日期:2004-05-20

Research on Slipcasting Process for BaTiO3-based Chip PTCR

LIU Huan; GONG Shu-Ping; CHEN Yan; ZHENG Zhi-Ping; ZHOU Dong-Xiang   

  1. Department of Electronic Science & Technology; Huazhong University of Science & Technology; Wuhan 430074; China
  • Received:2003-05-08 Revised:2003-07-01 Published:2004-05-20 Online:2004-05-20

摘要: 研究了片式BaTiO3基PTCR元件石膏模注浆成型工艺,通过控制pH值、粘合剂及分散剂的含量,获得具有较高固相比和较低粘度的浆料.在PVA和分散剂占粉料质量比分别为0.8%和0.4%且pH=9时,获得的浆料最高固相质量分数为80%(固相体积分数为55%).利用注浆成型能够通过模具尺寸及吸浆时间来控制膜厚的特点,成功制备出厚度为0.4mm且具有一定强度和密度的生坯,并考察了注浆成型瓷片的PTCR效应,且对成型过程中的一些现象作出了分析和讨论.

关键词: 片式PTCR, 注浆成型, 浆料

Abstract: In order to acquire highly concentrated BaTiO3 slurry suitable for slipcasting process, the factors, that may influence the property of slurry, were investigated. The results obtained show that when pH=9 and the weight concentration of PVA and dispersant is 0.8% and 0.4% respectively, the solids loading as high as 80wt%(55vol%) can be achieved. In addition, The PTCR effect of chip PTCR formed by this slipcasting process was examined.

Key words: chip PTCR, slipcasting, slurry

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