关键词: 电子封装, SPS, 热导率, 热膨胀系数

Abstract: SiC particles, pure aluminum powder and silicon powder were applied to prepare SiC particles reinforced Al-matrix composites for electronic packaging application. Al-matrix composites reinforced with SiC particles were fabricated by SPS. The composites were dense and SiC particles distributed homogenously in Al-matrix. According to the investigation of SPS process, the sintering process of the composite, belongs to a reactive sintering, the majority of sintering shrinkage can be finished in a short period. Effects of SiC volume fraction and particles sizes
on thermal conductivity and coefficient of thermal expansion were investigated. The results indicate that thermal conductivity and coefficient of thermal expansion decrease with the increase of SiC volume fraction, and thermal
conductivity increases but coefficient of thermal expansion decreases with the increase of SiC particles sizes.

Key words: electronic packaging, SPS, thermal conductivity, coefficient of thermal expansion