Bi0.5Sb1.5Te3/环氧树脂柔性复合热电厚膜的制备及其面内制冷性能

doi:10.15541/jim20180528

摘要/Abstract

摘要：

利用丝网印刷法在聚酰亚胺基板上制备了Bi_0.5Sb_1.5Te₃/环氧树脂柔性复合热电厚膜, 通过优化Bi_0.5Sb_1.5Te₃粉末含量提高了其电输运性能。复合厚膜在300 K时的最优功率因子达到1.12 mW·m ^-1·K ^-2, 较前期报道的数值提高了33%。抗弯测试表明复合厚膜的电阻在弯曲半径大于20 mm时基本不变, 在弯曲半径为20 mm, 弯曲次数小于3000次时, 仅有轻微增大, 说明其在柔性热电器件领域具有应用潜力。红外热成像技术显示, 在工作电流为0.01 A到0.05 A时, 复合厚膜热电臂两端可以形成4.2 ℃到7.8 ℃的温差, 表明了其在面内制冷领域应用的可能性。

关键词: 柔性热电厚膜, 丝网印刷法, Bi_0.5Sb_1.5Te₃/环氧树脂复合厚膜, 电输运性能, 面内制冷领域

Abstract:

Flexible Bi_0.5Sb_1.5Te₃/epoxy composite thermoelectric films were prepared on polyimide substrates by screen printing. Its electrical transport properties are enhanced by optimizing the content of Bi_0.5Sb_1.5Te₃ powder. The highest power factor of the optimized Bi_0.5Sb_1.5Te₃/epoxy films reached 1.12 mW·m ^-1·K ^-2at 300 K, increased by 33% as compared with previous value. The anti-bending test results show that resistance of the thick films remains unchanged when the bending radius is over 20 mm and slightly increases within 3000 bending cycles when the bending radius is 20 mm, implying that the as-prepared films have potential application in flexible TE devices. The flexible thermoelectric leg could establish a temperature difference from 4.2 ℃ to 7.8 ℃ under working current from 0.01 A to 0.05 A, showing potential application in planar cooling field.

Key words: flexible thermoelectric films, screen printing, Bi_0.5Sb_1.5Te₃/epoxy composite films, electrical property, planar cooling field

中图分类号:

TQ174

李鹏, 聂晓蕾, 田烨, 方文兵, 魏平, 朱婉婷, 孙志刚, 张清杰, 赵文俞. Bi_0.5Sb_1.5Te₃/环氧树脂柔性复合热电厚膜的制备及其面内制冷性能[J]. 无机材料学报, 2019, 34(6): 679-684.

Peng LI, Xiao-Lei NIE, Ye TIAN, Wen-Bing FANG, Ping WEI, Wan-Ting ZHU, Zhi-Gang SUN, Qing-Jie ZHANG, Wen-Yu ZHAO. Fabrication and Planar Cooling Performance of Flexible Bi_0.5Sb_1.5Te₃/epoxy Composite Thermoelectric Films[J]. Journal of Inorganic Materials, 2019, 34(6): 679-684.

图/表 7

Fig. 1 XRD patterns of the composite films prepared with different contents of Bi0.5Sb1.5Te3 powder

Fig. 2 Cross-sectional FESEM images of the composite thick films prepared with different contents of Bi0.5Sb1.5Te3 powder (a, f) x= 6.5; (b, g) x= 7; (c, h) x= 8; (d, i) x= 9; (e, j) x= 10

Table 1 Densities and electrical properties of the composite films at room temperature

x	ρ/(g·cm^-3)	R_H/(×10^-1, cm³·C^-1)	n/(×10¹⁹, cm^-3)	μ_H/(cm²·V^-1·s^-1)	σ/(×10⁴, S·m^-1)
6.5	3.93	3.72	1.67	45.15	1.21
7	4.08	3.69	1.69	52.17	1.41
8	4.32	3.57	1.74	58.85	1.65
9	4.19	3.56	1.73	54.69	1.51
10	4.05	3.55	1.72	50.59	1.40

Fig. 3 Temperature dependence of (a) electrical conductivity σ, (b) Seebeck coefficient α and (c) power factor α2σ of the composite thick films prepared with different content of Bi0.5Sb1.5Te3 powder

Table 2 Comparison of σ and α2σ of Bi2Te3-based composite films reported by different groups

Materials	Fabrication process	Annealing methods	σ/(×10⁴, S·m^-1)	α²σ/(mW·m^-1·K^-2)	Ref.
Bi_0.5Sb_1.5Te₃+epoxy	Screen printing	573 K, 4 h, hot pressing	1.67	1.12	This work
Bi_0.5Sb_1.5Te₃ ink	Inkjet printing	673 K, 30 min	0.20	0.07	[10]
Bi_0.5Sb_1.5Te₃+8%Te-epoxy	Dispenser printing	523 K	0.11	0.06	[14]
Bi_0.5Sb_1.5Te₃+C₂₄H₄₄O₆	Brush-printed	673 K, 4 h	0.29	0.15	[17]
Bi₂Te₃+1%Se-epoxy	Dispenser printing	623 K, 12 h	1.03	0.26	[20]
Bi_0.5Sb_1.5Te₃+epoxy	Brush-printed	623 K, 4 h, hot pressing	1.15	0.84	[22]
Bi_0.5Sb_1.5Te₃+8%Te-polymer	Dispenser printing	523 K	0.13	0.16	[25]

Fig. 4 Anti-bending tests of flexible films: (a) bending radius and (b) bending cycles

Fig. 5 Visual infrared images of the composite thick films measured with different currents (I) (a) I=0.01 A; (b) I=0.02 A; (c) I=0.03 A; (d) I=0.04 A; (e) I=0.05 A

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Bi_0.5Sb_1.5Te₃/环氧树脂柔性复合热电厚膜的制备及其面内制冷性能

Fabrication and Planar Cooling Performance of Flexible Bi_0.5Sb_1.5Te₃/epoxy Composite Thermoelectric Films

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