无机材料学报 ›› 2019, Vol. 34 ›› Issue (1): 79-84.DOI: 10.15541/jim20180167

所属专题: MAX相和MXene材料

• 研究论文 • 上一篇    下一篇

p型氧化镍薄膜晶体管的微流控法制备研究

梁玉1,2, 梁凌燕1, 吴卫华1, 裴郁1, 姚志强2, 曹鸿涛1   

  1. 1. 中国科学院 宁波材料技术与工程研究所, 浙江省石墨烯应用研究重点实验室, 宁波 315201;
    2. 郑州大学 材料科学与工程学院, 国家低碳环保材料智能设计国际联合研究中心, 郑州 450001
  • 收稿日期:2018-04-16 修回日期:2018-07-17 出版日期:2019-01-21 网络出版日期:2018-12-17
  • 作者简介:梁玉(1993-),女,硕士研究生. E-mail: 292707377@qq.com
  • 基金资助:
    国家自然科学基金(51772276);宁波市科技创新团队(2016B100005);National Natural Science Foundation of China (51772276);Ningbo Municipal Science and Technology Innovative Research Team (2016B100005)

Microfluidic-method-processed p-type NiOx Thin-film Transistors

LIANG Yu1,2, LIANG Ling-Yan1, WU Wei-Hua1, PEI Yu1, YAO Zhi-Qiang2, CAO Hong-Tao1   

  1. 1. Key Laboratory of Graphene Technologies and Applications of Zhejiang Province, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China;
    2. State Centre for International Cooperation on Designer Low-Carbon and Environmental Materials (ICDLCEM), School of Material Science and Engineering, Zhengzhou University, Zhengzhou 450001, China
  • Received:2018-04-16 Revised:2018-07-17 Published:2019-01-21 Online:2018-12-17
  • About author:LIANG Yu. E-mail: 292707377@qq.com

摘要:

可以图形化和沉积同时进行的镀膜技术可有效简化器件制备流程, 从而降低成本。本工作研究了一种新型的图形化沉积镀膜技术-微流控法: 将宽度及间隔均为80 μm、沟槽深度为2 μm左右的PDMS模板与衬底贴合构筑微流通道, 毛细力作用下前驱液可在微流通道内流动, 并在衬底表面形成图形化的液膜, 最后经热处理完成图行化的薄膜沉积。此外, 分析了硝酸镍/2-甲氧基乙醇前驱体的热分解过程和不同温度退火下前驱体粉末的相结构演化规律。最终利用微流控法图形化沉积技术制备了图形化的氧化镍沟道, 并构筑了薄膜晶体管器件。优化后的薄膜晶体管表现出典型的p型特征, 场效应迁移率可达0.8 cm2·V-1·s-1

 

关键词: 氧化物半导体, 溶液法, 浸润性, 薄膜晶体管, 热失重-差热曲线

Abstract:

It’s essential to develop patterning deposition methods to simplify the process of device fabrication and then reduce the production cost. In this work, a new patterning deposition method, i.e. microfluidic method, was demonstrated in details. In this technology, a micro-fluidic channel with a width of 80 μm and a height of 2 μm can be constructed between PDMS modules and substrates, and under capillary force precursor drops will move through the channel to form a patterned liquid film which is then fixed on the substrate via thermal treatments, and finally patterned films are prepared. In addition, the thermal-driven solidification process from NiOx precursor powder to oxide was investigated through thermogravimetric/differential thermal analysis (TG-DTA) measurement. And the evolution of phase structure of the NiOx precursor powder was analyzed with respect to post-annealing temperatures. Finally, thin-film transistors were fabricated applying the patterned NiOx thin films as channels, and the optimized device showed typical p-type transistor features, with a field-effect mobility up to 0.8 cm2·V-1·s-1.

Key words: oxide semiconductors, solution method, wettability, thin-film transistors, TG-DTA curves

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