无机材料学报 ›› 2018, Vol. 33 ›› Issue (10): 1089-1096.DOI: 10.15541/jim20180004

• 研究论文 • 上一篇    下一篇

TiCuO薄膜的显微结构对Cu离子释放和内皮细胞行为的影响

程丹1, 黄斌1, 陈涛1, 景凤娟1, 谢东2, 冷永祥1, 黄楠1   

  1. 西南交通大学 1.材料科学与工程学院, 先进材料技术教育部重点实验室;2.物理科学与技术学院, 成都 610031
  • 收稿日期:2018-01-02 修回日期:2018-01-31 出版日期:2018-10-20 网络出版日期:2018-09-25
  • 作者简介:程 丹(1993-), 女, 硕士研究生. E-mail: chengdan1193@163.com
  • 基金资助:
    国家自然科学基金(31300787, 31270020, U1330113)

Microstructure of TiCuO Films on Copper Ion Release and Endothelial Cell Behavior

CHENG Dan1, HUANG Bin1, CHEN Tao1, JING Feng-Juan1, XIE Dong2, LENG Yong-Xiang1, HUANG Nan1   

  1. 1.Key Laboratory for Advanced Technologies of Materials, Ministry of Education, School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu 610031, China;2. School of Physics Science and Technology, Southwest Jiaotong University, Chengdu 610031, China
  • Received:2018-01-02 Revised:2018-01-31 Published:2018-10-20 Online:2018-09-25
  • About author:CHENG Dan. E-mail: chengdan1193@163.com
  • Supported by:
    National Natural Science Foundation of China (31300787, 31270020, U1330113)

摘要:

采用直流磁控溅射技术, 在Si片和316L SS基体上制备了不同Cu含量的TiCuO薄膜。采用X射线衍射仪(XRD)、透射电镜(TEM)、X 射线能谱仪(EDS)和X射线光电子能谱(XPS)对薄膜的显微结构和化学组成进行了分析。采用电化学腐蚀和模拟体液浸泡实验评价了薄膜的腐蚀性能和Cu离子释放特性。体外静态培养内皮细胞后, 采用细胞计数试剂盒(CCK-8)评价了TiCuO薄膜的细胞活性。研究结果表明, 未掺杂的TiO2薄膜为金红石相, 掺入Cu后的TiCuO薄膜由非晶基体上含有Cu2O的纳米晶粒构成。薄膜中的富Cu区引起了薄膜腐蚀。含Cu量高的TiCuO薄膜更易被腐蚀, 并释放出较多Cu离子。TiCuO薄膜释放出一定浓度的Cu离子促进了内皮细胞活性。研究表明, TiCuO薄膜的含Cu量和显微结构影响了Cu离子释放, 对其内皮细胞活性起了关键作用。

 

关键词: TiCuO薄膜, 磁控溅射, Cu离子释放, 内皮细胞治性

Abstract:

TiCuO films with different microstructures and Cu contents were prepared on Si and 316L SS substrates using DC magnetron sputtering. The microstructure and chemical composition of the films were analyzed by X-ray diffraction (XRD), transmission electron microscopy (TEM), X-ray energy dispersive spectroscopy (EDS), and X-ray photoelectron spectroscopy (XPS). Corrosion behavior and Cu ions release properties of the films were evaluated by electrochemical corrosion and simulated body-fluid immersion tests, respectively. Endothelial cell (EC) viability on the films was evaluated by CCK-8 assay in vitro. Un-doped TiO2 films exhibit rutile phases. After Cu incorporation, the TiCuO films consist of nano-crystalline grains of Cu2O on their amorphous matrix. The films with higher Cu contents are more susceptible to corrosion and release more Cu ions. The Cu-rich phases of the films result in corrosion. EC viability is enhanced by a certain concentration of Cu ions released from TiCuO films. All above results demonstrated that microstructures and Cu contents of TiCuO films play an important role in controlling copper ions release behaviors, and therefore affect the EC viability.

Key words: TiCuO films, magnetron sputtering, Cu ions release, ECs viability

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