Cu/Ti3SiC2体系润湿性及润湿过程的研究

doi:10.15541/jim20140115

摘要/Abstract

摘要：

采用座滴法研究了温度及Ti₃SiC₂的两个组成元素Si和Ti对Cu/Ti₃SiC₂体系润湿性的影响。结果表明, Cu与Ti₃SiC₂之间有良好的润湿性, 且润湿过程属于反应性润湿。随着温度的升高, Cu与Ti₃SiC₂间的反应区扩大, 反应层深度增加, 润湿角减小, 温度超过1250℃后反应明显加快, 至1270℃时润湿角降至15.1°。物相分析与微观结构研究表明, Cu/Ti₃SiC₂界面区域发生了化学反应, 反应产物主要为TiC_x和Cu_xSi_y, 同时发生元素的互扩散, 形成反应中间层, 改变体系的界面结构, 促进了Cu和Ti₃SiC₂基体的界面结合, 从而改善了体系的润湿性。在Cu中添加Si抑制了Ti₃SiC₂的分解, 而添加Ti阻碍了Cu向Ti₃SiC₂的渗入, 均不利于Cu/Ti₃SiC₂体系润湿性的改善。

关键词: Cu/Ti3SiC2, 润湿性, 界面反应

Abstract:

Effects of wetting temperature and Ti₃SiC₂constituent elements Si and Ti on the wettability of Cu/Ti₃SiC₂ system were investigated in vacuum via sessile drop technique. The results show that the wettability of Cu/Ti₃SiC₂ system is fairly well at elevated temperature because of the reaction between Cu and Ti₃SiC₂. The reaction zone in Cu/Ti₃SiC₂ interface becomes larger and deeper with the temperature increasing, and which leads to the decrease in contact angle. Its reaction rate is accelerated when the temperature exceeds 1250℃. The minimum contact angle of 15.1° is measured at 1270℃. XRD and SEM results indicate that the reaction products are TiC_x and Cu_xSi_y, and the reaction layer is mainly consisted of Cu, Ti₃SiC₂, TiC_x and Cu_xSi_y depending on the wetting temperature. The wettability of Cu/Ti₃SiC₂ system is improved by the reaction layer. Adding alloying element Si or Ti to Cu is harmful to the wettability between Cu and Ti₃SiC₂ since Si inhibits the decomposition of Ti₃SiC₂ and Ti hinders the infiltration of Cu into Ti₃SiC₂.

Key words: Cu/Ti3SiC2, wettability, interfacial reaction

中图分类号:

TG148

路金蓉, 周洋, 李海燕, 郑涌, 李世波, 黄振莺. Cu/Ti₃SiC₂体系润湿性及润湿过程的研究[J]. 无机材料学报, 2014, 29(12): 1313-1319.

LU Jin-Rong, ZHOU Yang, LI Hai-Yan, ZHENG Yong, LI Shi-Bo, HUANG Zhen-Ying. Wettability and Wetting Process in Cu/Ti₃SiC₂ System[J]. Journal of Inorganic Materials, 2014, 29(12): 1313-1319.

图/表 10

图1 Cu/Ti3SiC2体系润湿角与温度的关系

Fig. 1 Relationship between contact angle and temperature for Cu/Ti3SiC2 system

图2 不同温度恒温润湿试验后Cu/Ti3SiC2润湿界面形貌

Fig. 2 Photographs of the wetting interface of Cu/Ti3SiC2 tested at different temperatures (a) 1100℃; (b) 1200℃; (c) 1300℃

图3 铜在Ti3SiC2中渗入深度与润湿温度的关系

Fig. 3 Relationship between the diffusion depth of Cu and wetting temperature

图4 不同温度恒温润湿后Cu/Ti3SiC2润湿界面的XRD图谱

Fig. 4 XRD patterns of the wetting interface of Cu/Ti3SiC2 wetted at different temperatures

图5 Cu/Ti3SiC2润湿样品剖面微观形貌及EDS点分析位置示意图

Fig. 5 Microstructure of the longitudinal section of Ti3SiC2 wetted by Cu at 1270℃ (a) Microstructure; (b) Enlarged image of the rectangular area marked in layer A showing the positions for EDS spot analysis; (c) Enlarged image of the rectangular area marked in the interfacial area between layer A and layer B; (d) Enlarged image of the rectangular area marked in layer B

表1 图5(b) 中Cu/Ti3SiC2体系界面区域3个特征点的EDS点分析结果

Table 1 EDS spot analyses in the interfacial area of Cu/Ti3SiC2 system as shown in Fig. 5(b)

Atomic fraction / %
	C	Si	Ti	Cu
1	41.87	8.05	42.09	7.99
2	46.31	12.04	41.65	0
3	45.36	7.27	25.67	21.70

图6 图5(a)中从A区到B区的Cu含量线扫描图

Fig. 6 EDS line scanning analysis of Cu from layer A to layer B as shown in Fig. 5(a)

图7 Cu-1wt%Si/Ti3SiC2体系润湿角与温度的关系

Fig. 7 Relationship between the contact angle and the experimental temperature for Cu-1wt%Si/Ti3SiC2 system

图8 Cu-1wt%Ti/Ti3SiC2体系润湿角与温度的关系

Fig. 8 Relationship between the contact angle and the experimental temperature for Cu-1wt%Ti/Ti3SiC2 system

图9 润湿试验前后Cu-1wt%Ti合金块底面微观形貌及Ti元素面分布图

Fig. 9 Morphologies and element distributions of Ti in the base area of Cu-1wt%Ti alloy block (a1) Morphology before wetting experiment; (a2) Distribution of Ti in (a1); (b1) Morphology after wetting experiment; (b2) Distribution of Ti in (b1)

参考文献 18

[1]	LI Y, LIU N, ZHANG X B, et al.Effect of carbon content on the microstructure and mechanical properties of ultra-fine grade (Ti,W)(C,N)-Co cermets. J. Mater. Process Tech., 2008, 206(1/2/3): 365-373.
[2]	AZADMEHR A, TAHERI-NASSAJ E. An in situ (W,Ti)C-Ni composite fabricated by SHS method. J. Non-cryst. Solids, 2008, 354(27): 3225-3234.
[3]	WANG L D, XUE Z W, QIAO Y J, et al.Anisotropic thermal expansion behaviors of copper matrix in β-eucryptite/copper composite. Mater. Sci. Eng. B, 2012, 177(11): 873-876.
[4]	LIU De-Bao, CUI Chun-Xiang.Fabrication and electrical conductivity property of copper-matrix composites reinforced with different ceramics particles. Journal of Functional Materials, 2004, 35: 1064-1067
[5]	LI H, PENG L M, GONG M, et al.Preparation and characte rization of Ti3SiC2 powder. Ceram. Int., 2004, 30(8): 2289-2294.
[6]	ZHANG Z F, SUN Z M, HASHIMOTO H, et al.Effects of sintering temperature and Si content on the purity of Ti3SiC2 synthesized from Ti/Si/TiC powders. J. Alloys Compd., 2003, 352(1/2): 283-289.
[7]	GAO Run-Feng, MEI Bing-Chu, ZHU Jiao-Qun, et al.Research on new material for pantograph slide plates Cu/Ti3SiC2. Rare Metals Letters, 2005, 24(11):16-20.
[8]	GAO H P, ZHANG J, LI F Z, et al.Surface strengthening of Ti3SiC2 through magnetron sputtering Cu and subsequent annealing. J. Eur. Ceram. Soc., 2008, 28(10): 2099-2107.
[9]	SUN JIAN-JUN, ZHOU YANG, LU JIN-RONG, et al. Preparation and properties of Ti3SiC2/Cu composites. Materials Science and Engineering of Powder Metallurgy, 2011, 16(4):587-590.
[10]	LU J R, ZHOU Y, ZHENG Y, et al. Effects of sintering process on the properties of Ti3SiC2/Cu composite. Key Engineering Materials, 2012, 512-515:377-381.
[11]	YANG SHU-XIA, MEI BING-CHU, ZHOU WEI-BING, et al. Study on the carbon fiber reinforced Cu-Ti3SiC2 composite. Rare Metals Letters, 2008, 27(9):39-42.
[12]	CHEN JIAN, GU MING-YUAN, PAN FU-SHENG. Work of adhesion for reactive metal/ceramic systems. Acta Materiae Compositae Sinica, 2003, 20(3):85-88.
[13]	CHEN MING-HAI, LIU NING, XU YU-DONG. Development of research on the wettability of metal on ceramics. Cemented Carbide, 2002, 19(4):199-205.
[14]	LANDRY K, KALOGEROPOULOU S, EUSTATHOPOULOS N.Wettability of carbon by aluminum and aluminum alloys. Mater. Sci. and Eng. A, 1998, 254(1/2):99-111.
[15]	EUSTATHOPOULOS N.Dynamics of wetting in reactive metal/ ceramic systems. Acta Mater., 1998, 46(7): 2319-2327.
[16]	ZARRINFAR N, KENNEDY A R, SHIPWAY P H.Reaction synthesis of Cu-TiCx master-alloys for the production of copper- based composites. Scripta Mater., 2004, 50(7):949-952.
[17]	KOOI B J, POPPEN R J, CARVALHO N J M. Ti3SiC2: a damage tolerant ceramic studied with nano-indentations and transmission electron microscopy. Acta Mater., 2003, 51(10): 2859-2872.
[18]	CHEN KANG-HUA, BAO CONG-XI, LIU HONG-WEI. Review of the study on the wettability of metal-ceramic. Materials Science and Engineering, 1997, 11(2):1-5.

Cu/Ti₃SiC₂体系润湿性及润湿过程的研究

Wettability and Wetting Process in Cu/Ti₃SiC₂ System

RichHTML

PDF (PC)

可视化

被引次数

摘要/Abstract

引用本文

使用本文

图/表 10

参考文献 18

相关文章 15

编辑推荐

Metrics

本文评价

[1]	丁健翔,黄培艳,查余辉,汪丹丹,张培根,田无边,孙正明. 高纯Ti₂AlC粉末的无压制备及其在Ag基电触头材料的应用[J]. 无机材料学报, 2020, 35(6): 729-734.
[2]	赵占奎, 李涛, 鲁书含, 王明罡, 张京京, 程道文, 吴臣, 迟悦, 王虹力. SPS界面反应增强机制调控的软磁复合材料磁性能和电阻率[J]. 无机材料学报, 2020, 35(11): 1223-1226.
[3]	李栋, 雷超, 赖华, 刘小林, 姚文俐, 梁彤祥, 钟盛文. 全固态锂离子电池正极与石榴石型固体电解质界面的研究进展[J]. 无机材料学报, 2019, 34(7): 694-702.
[4]	张浩, 高鹏越, 陈光耀, 李明阳, 鲁雄刚, 李重河. Al₂O₃/BaZrO₃双陶瓷界面微观组织演化及机理[J]. 无机材料学报, 2017, 32(8): 819-824.
[5]	陈凡, 石恺成, 孙士阳, 赵博文, 尚海龙, 李戈扬. 不基于熔态润湿的Al/Al₂O₃直接钎焊[J]. 无机材料学报, 2016, 31(6): 602-606.
[6]	张莉莉, 李可, 于称称, 张玉文, 吴成章, 丁伟中. Ag-Cu钎料与双相陶瓷透氧膜的润湿和界面反应研究[J]. 无机材料学报, 2016, 31(6): 607-612.
[7]	鲁元, 李京龙, 杨建锋, 李鹏. 热处理温度对双连续β-氮化硅增强铝基复合材料性能的影响[J]. 无机材料学报, 2015, 30(3): 277-281.
[8]	罗凌虹, 余辉, 黄祖志. 中温固体氧化物燃料电池封接玻璃的研究进展[J]. 无机材料学报, 2015, 30(2): 113-121.
[9]	王贺云, 刘茜, 周遥, 周真真，刘光辉. 碳纤维复合Si₃N₄陶瓷材料的制备及性能研究[J]. 无机材料学报, 2014, 29(9): 1003-1008.
[10]	陆有军, 王燕民, 潘志东, 黄振坤, 吴澜尔. 纳米碳含量对碳/碳化硅陶瓷的机械加工性及与玻璃熔体润湿性的影响[J]. 无机材料学报, 2014, 29(4): 429-432.
[11]	张强, 姜龙涛, 武高辉. 无压浸渗法制备氧化态SiC颗粒增强铝基复合材料[J]. 无机材料学报, 2012, 27(4): 353-357.
[12]	黄麟, 宁聪琴, 丁冬雁, 白硕, 秦锐, 李明, 毛大立. 掺杂TiO₂纳米管的润湿性能与体外生物活性[J]. 无机材料学报, 2010, 25(7): 775-779.
[13]	李家科,刘磊,刘意春,张文龙,胡文彬. Ti-Si共晶钎料的制备及其对SiC陶瓷可焊性[J]. 无机材料学报, 2009, 24(1): 204-208.
[14]	杨靖,陈杰瑢,余嵘. 溶胶-凝胶法改性SiO₂膜的润湿性与水汽稳定性[J]. 无机材料学报, 2008, 23(4): 739-744.
[15]	钱柏太,沈自求. 控制表面氧化法制备超疏水 CuO纳米花膜[J]. 无机材料学报, 2006, 21(3): 747-752.