反应烧结碳化硅的磨削特征

doi:10.3724/SP.J.1077.2012.11514

无机材料学报 ›› 2012, Vol. 27 ›› Issue (7): 764-768.DOI: 10.3724/SP.J.1077.2012.11514

反应烧结碳化硅的磨削特征

姚旺¹, 张宇民², 韩杰才², 周玉锋²

(1. 哈尔滨工业大学(威海) 材料科学与工程学院, 威海 264200; 2. 哈尔滨工业大学复合材料与结构研究所, 哈尔滨, 150001)

收稿日期:2011-08-16 修回日期:2011-10-12 出版日期:2012-07-20 网络出版日期:2012-06-06
基金资助:
山东省自然科学基金(ZR2010EQ032)

Grinding Characteristics of Reaction Bonded Silicon Carbide

YAO Wang¹, ZHANG Yu-Min², HAN Jie-Cai², ZHOU Yu-Feng²

(1. School of Materials Science and Engineering, Harbin Institute of Technology, Weihai 264200, China; 2. Center for Composite Materials and Structures, Harbin Institute of Technology, Harbin 150001, China)

Received:2011-08-16 Revised:2011-10-12 Published:2012-07-20 Online:2012-06-06
Supported by:
Natural Science Foundation of Shandong Province (ZR2010EQ032)

摘要/Abstract

摘要： 采用金刚石砂轮对(RBSiC)进行磨削, 系统研究了表面形貌、残余应力和弯曲强度等磨削特征. 结果显示, 材料主要以脆性断裂去除, 局部区域为塑性切除. 随着轴向进给增大, 表面粗糙度(R_a)增加, 为降低R_a可进行适当光刀. 随着轴向进给增加, 磨削区的冷却效果被削弱, 使磨削残余压应力值下降. 与0.9 μm/s相比, 用1.35 μm/s磨削后试样的表面损伤程度增加. 工作台转速2.1 r/min、轴向进给0.9 μm/s并光刀1 min是保证高加工效率并获得较好质量表面的最优参数.

关键词: 碳化硅, 磨削, 残余应力, 裂纹, 弯曲强度

Abstract: Surface topography, surface residual stress and bending strength of RBSiC ground using diamond wheel were studied. Grinding RBSiC is removed mainly by brittle fracture and lightly by ductile cutting. With the increase of down feed, surface roughness Ra increases. Burnishing with no down feed can improve the Ra in some way. With increasing down feed, the compressive residual stress decreases because of an inadequately cooling effect. Compare with the specimens grounded using 0.9 μm/s, those using down feed of 1.35 μm/s have worse surface quality. Considering both the processing efficiency and the surface quality, the optimum parameters are as follow: 0.9 μm/s down feed, 2.1 r/min work table rotational speed and 1 min burnishing.

Key words: SiC, grinding, residual stress, crack, bending strength

中图分类号:

TH751

姚旺, 张宇民, 韩杰才, 周玉锋. 反应烧结碳化硅的磨削特征[J]. 无机材料学报, 2012, 27(7): 764-768.

YAO Wang, ZHANG Yu-Min, HAN Jie-Cai, ZHOU Yu-Feng. Grinding Characteristics of Reaction Bonded Silicon Carbide[J]. Journal of Inorganic Materials, 2012, 27(7): 764-768.

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反应烧结碳化硅的磨削特征

Grinding Characteristics of Reaction Bonded Silicon Carbide

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