CuO 掺杂 SrFe0.9Sn0.1O3- δ 负温度系数厚膜热敏电阻的电学性能

doi:10.3724/SP.J.1077.2011.00387

无机材料学报 ›› 2011, Vol. 26 ›› Issue (4): 387-392.DOI: 10.3724/SP.J.1077.2011.00387

CuO 掺杂 SrFe_0.9Sn_0.1O_{3- δ} 负温度系数厚膜热敏电阻的电学性能

袁昌来 ¹,² , 巫秀芳 ¹ , 刘心宇 ¹,² , 黄静月 ¹ , 李擘 ¹ , 梁梅芳 ¹ , 莫崇贵 ¹

1. 桂林电子科技大学广西信息材料重点实验室 , 桂林 541004; 2. 中南大学材料科学与工程学院 , 长沙 410083

收稿日期:2010-06-17 修回日期:2010-11-11 出版日期:2011-04-20 网络出版日期:2011-04-22
作者简介:袁昌来 (1979 - ), 男 , 博士研究生 , 讲师 .
基金资助:
国家大学生创新性实验计划资助项目 ( 081059516 ); 广西信息材料重点实验室研究基金 ( 0710908-07-Z )

Electrical Properties of CuO-doped SrFe_0.9Sn_0.1O_{3- δ} Thick Film NTC Thermistors

YUAN Chang-Lai¹,²,WU Xiu-Fang¹,LIU Xin-Yu¹,²,HUANG Jing-Yue¹,LI Bo¹,LIANG Mei-Fang¹,MO Chong-Gui¹

1. Key Laboratory of Information Materials of Guangxi, Guilin University of Electronic Technology, Guilin 541004, China; 2.College of Materials Science and Engineering, Central South University, Changsha 410083, China

Received:2010-06-17 Revised:2010-11-11 Published:2011-04-20 Online:2011-04-22
Supported by:
National University Student Innovation Test Plan (081059516); Research Fundation of Key Laboratory of Informationa Materials of GuangXi Province (0710908-07-Z)

摘要/Abstract

摘要： 采用印刷法制备了CuO掺杂SrFe_0.9Sn_0.1O₃_-δ(CSFS)厚膜负温度系数(NTC)热敏电阻(掺杂量为20mol%~50mol%). 对其微观结构及电性能研究发现: 随着CuO掺杂含量的增加,厚膜表面变得更加致密, 室温电阻逐渐降低至0.46MΩ, 而热敏常数基本保持在3300K附近. CuO的加入导致SrFe_0.9Sn_0.1O₃_-δ分裂成多种铁含量更低的SrFe_1-xSn_xO_3-δ物相(0.1<x<1). 借助两个串联的RQ等效部件组成的电路模型, 探讨了CuO含量为40mol%的SrFe_0.9Sn_0.1O₃厚膜在25~250℃范围内的阻抗特征, 发现厚膜电阻主要是由晶界电阻和晶粒电阻构成, 且这两个贡献电阻都呈现出明显的NTC热敏效应. 此外, 阻抗虚部和电学模量虚部峰值对应频率的高度匹配表明厚膜的主要导电方式为局域导电机制.

关键词: SrFe_0.9Sn_0.1O_3-δ, 厚膜NTC热敏电阻, CuO, 阻抗分析

Abstract: CuO-doped SrFe_0.9Sn_0.1O_{3- δ}(CSFS) thick-film negative temperature coefficient (NTC) thermistors ( 20mol%, 30mol%, 40mol%, 50mol% ) were prepared by the screen printing method. The microstructures and electrical prop erties of CSFS thick films were determined. With the increase of CuO content, the surface morphology of thick films becomes denser. The room-temperature resistance values gradually decreases to about 0.46 M Ω and the thermistor- constant values are basically constant at around 3300 K. After the addition of CuO, SrFe_0.9Sn_0.1O_{3- δ} is decomposed into various SrFe_{1- x}Sn _xO_{3- δ} ( 0.1< x<1 ) phases. By two- RQ series equivalent circuit model, impedance characteristics of the thick film containing 40mol% CuO content are investigated over the measured temperature range of 25–250 ℃ . It is found that the total thick-film resistance is mainly attributed to the contribution of grain and grain boundary resistances, both of which show the typical NTC thermistor characteristics. Furthermore, the complete match of peak frequencies between the imaginary parts of impedance and electric modulus suggests that delocalized conduction is the main conduction mechanism in the thick-film NTC thermistors.

Key words: SrFe_0.9Sn_0.1O_{3- δ}, thick-film NTC thermistors, CuO, impedance analysis

中图分类号:

TN372

袁昌来, 巫秀芳, 刘心宇, 黄静月, 李擘, 梁梅芳, 莫崇贵. CuO 掺杂 SrFe_0.9Sn_0.1O_{3- δ} 负温度系数厚膜热敏电阻的电学性能[J]. 无机材料学报, 2011, 26(4): 387-392.

YUAN Chang-Lai,WU Xiu-Fang,LIU Xin-Yu,HUANG Jing-Yue,LI Bo,LIANG Mei-Fang,MO Chong-Gui. Electrical Properties of CuO-doped SrFe_0.9Sn_0.1O_{3- δ} Thick Film NTC Thermistors[J]. Journal of Inorganic Materials, 2011, 26(4): 387-392.

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CuO 掺杂 SrFe_0.9Sn_0.1O_{3- δ} 负温度系数厚膜热敏电阻的电学性能

Electrical Properties of CuO-doped SrFe_0.9Sn_0.1O_{3- δ} Thick Film NTC Thermistors

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CuO 掺杂 SrFe0.9Sn0.1O3- δ 负温度系数厚膜热敏电阻的电学性能

Electrical Properties of CuO-doped SrFe0.9Sn0.1O3- δ Thick Film NTC Thermistors

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CuO 掺杂 SrFe_0.9Sn_0.1O_{3- δ} 负温度系数厚膜热敏电阻的电学性能

Electrical Properties of CuO-doped SrFe_0.9Sn_0.1O_{3- δ} Thick Film NTC Thermistors