高级检索
无机材料学报

无机材料学报 ›› 2011, Vol. 26 ›› Issue (3): 249-253.DOI: 10.3724/SP.J.1077.2011.00249

• 研究论文 • 上一篇    下一篇

铝和氮化铝陶瓷结合强度与机理研究

彭 榕1, 周和平2, 宁晓山2, 徐伟2   

  1. 1. 北京航空航天大学能源与动力工程学院, 航空发动机气动热力国防重点实验室, 北京100191; 2. 清华大学材料科学与工程系, 新型陶瓷与精细工艺国家重点实验室, 北京100084
  • 收稿日期:2010-05-31 修回日期:2010-07-23 出版日期:2011-03-20 网络出版日期:2011-02-18
  • 作者简介:彭榕(1972-), 男, 博士, 讲师.

Bonding Strength and Mechanism Between Aluminum and AlN

PENG Rong1, ZHOU He-Ping2, NING Xiao-Shan2, XU Wei2   

  1. 1. The State Key Lab of Aeroengine, School of Jet Propulsion,Beijing University of Aeronautics and Astronautics, Beijing 100084, China; 2. TheState Key Lab of New Ceramics and Fine Processing, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China
  • Received:2010-05-31 Revised:2010-07-23 Published:2011-03-20 Online:2011-02-18

PDF (PC)

1720

被引次数

11 | 1

摘要： 在氮气气氛下、保温10min、948~1098K利用活性金属铸接方法制备铝/氮化铝陶瓷基板, 用力学试验机、扫描电子显微镜、高温金相光学显微镜和原子力显微镜对铝/氮化铝陶瓷的结合强度和机理进行研究. 结合温度低于973K时, 铝和氮化铝陶瓷之间的剥离强度随结合温度升高线性增大, 当结合温度超过973K时, 结合温度对强度影响很小, 铝和氮化铝陶瓷之间的结合强度约为49N/mm, 铝和氮化铝陶瓷之间的结合为物理湿润和化学反应湿润共同作用.

关键词: 铝/氮化铝陶瓷基板, 结合强度, 结合机理

Abstract: Al/AlN substrate was produced by diecasting bonding process with the bonding time of 10 min in the range of 948K to1098K under N2 atmosphere. The bonding mechanism and strength were investigated by mechanic testing equipment, high-temperature metallographic microscope, AFM and SEM. When the bonding temperature is increased below 973K,the peeling strength of the aluminium with the AlN ceramic substrate rises linearly. While the bonding temperature is above 973K, the temperature influence on the bonding strength is not significant. The peeling strength ofthe pure aluminium with the AlN ceramic substrate is about 49N/mm. The bonding mechanism between aluminium and aluminium nitride can be ascribed to physical and chemical reaction wetting.

Key words: aluminum/AlNceramic substrate, bonding strength, bonding mechanism

中图分类号: