无机材料学报

• 研究论文 • 上一篇    下一篇

高密度无机功能材料芯片快速表征技术的发展

郭杏元; 刘庆峰; 刘茜   

  1. 中国科学院上海硅酸盐研究所高性能陶瓷和超微结构国家重点实验室 上海 200050
  • 收稿日期:2001-04-17 修回日期:2001-06-18 出版日期:2002-05-20 网络出版日期:2002-05-20

Development of High Throughput Screening of Samples on InorganicMaterial Chips

GUO Xing-Yuan; LIU Qing-Feng; LIU Qian   

  1. State Key Lab of High Performance Ceramics and Superfine Microstructure; Shanghai Institute of Ceramics; Chinese Academy of Sciences; Shanghai 200050; China
  • Received:2001-04-17 Revised:2001-06-18 Published:2002-05-20 Online:2002-05-20

摘要: 集成组合技术是近几年发展起来的一种快速发现和优比新型功能材料的方法,其发现和优化新型功能材料的效率比传统方法高出数百倍,甚至上千倍或更高,但是要充分发挥其在无机功能材料研究领域的优势,必须解决三个问题,(i)材料芯片的设计;(ii)材料芯片的高速并行合成;(iii)材料芯片的快速表征.其中材料芯片的快速表征技术又是关键之关键,它制约着整个研究工作的开展,如果能高速设计、合成材料芯片却不能快速地来表征它,那么高速合成将失去其快速发现和优化新型功能材料的意义,因此,开发适用于高密度材料芯片性能和结构的快速表征技术有着非常重大的意义.本文综述了近几年无机功能材料芯片的几种快速表征技术:光致发光性能检测、电光/磁光性能检测、微波性能检测以及结构表证技术等,并简述了它们的工作原理及仪器设备情况.

关键词: 集成组合技术, 高通量筛选, 光致发光, 电光/磁光, 微波近场显微镜

Abstract: Combinatorial materials synthesis methods and high throughput screening techniques have been
developed to accelerate the process of materials discovery and optimization. In order to apply combinatorial strategies for the innovative materials
technology successfully, there are three main stages involved, that is: (i) design of the material chip; (ii) high throughput synthesis of the
chip; and (iii) rapid characterization of the chip,i.e. high throughput screening. Further more,high throughput screening is the most important
component of combinatorial materials science and technology, it is a major limitation at present. This paper summarizes varieties of high throughput
screening methods including microspot X-ray methods, optical measurement techniques, and a novel evanescent microwave microscope used to characterize
structural, optical, magnetic, and electrical properties of samples on inorganic material chips.

Key words: combinatorial, high throughput screening, photoluminescence, electro/magneto-optical, SEMM(scanning evanescent microwave microscope)

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