铜对双靶共溅制备热电薄膜输运性能的影响
曹丽莉, 王瑶, 邓元, 罗炳威, 祝薇, 史永明, 林桢
特种功能材料与薄膜北京市重点实验室, 北京航空航天大学 材料学院,北京 100191
摘要

采用双靶共溅法制备了铜掺杂的碲化铋锑热电薄膜,铜与碲化铋锑共溅的方法有利于形成沿c轴方向择优生长的碲化铋锑薄膜。结果表明,铜原子均匀的掺杂在碲化铋锑薄膜材料中。由于铜原子有利于提高载流子迁移率,薄膜材料的电导率随着铜掺杂比例的提高得到了极大的提升。当铜靶的溅射功率为20 W时,可以得到最高的电导率(15 × 104 S/m),同时功率因子的最佳值可提升到20 μW/(cm•K2)。

关键词: 半导体; 薄膜; 热电性能; 磁控溅射
中图分类号:TB34   文献标志码:A    文章编号:1000-324X(2014)02-0215-05
Influence of Cu on Transport Properties of Thermoelectric Thin Film Fabricatedvia Magnetron Co-sputtering Method
CAO Li-Li, WANG Yao, DENG Yuan, LUO Bing-Wei, ZHU Wei, SHI Yong-Ming, LIN Zhen
Beijing Key Laboratory of Special Functional Materials and Films, School of Material Science and Engineering, Beihang University, Beijing 100191, China
Corresponding author: DENG Yuan, professor. E-mail:dengyuan@buaa.edu.cn
Abstract

A simple magnetron co-sputtering method was used to fabricate Cu dispersed Bi0.5Sb1.5Te3 thin films, and the co-sputtering method was beneficial to the preferential growth of Bi0.5Sb1.5Te3 thin films alongc-axis. Cu atoms were well-dispersed in the nano-structured materials. The electrical conductivity sharply increased with the increasing content of Cu due to the effect of Cu on transport property. For Cu target sputtering power of 20 W, a maximum power factor of 20 μW/(cm•K2) with an electrical conductivity of 15 × 104 S/m at 355 K were achieved.

Keyword: semiconductors; thin films; thermoelectric properties; magnetron sputtering

Thermoelectric (TE) effect is an important process for the conversion of waste heat into electricity silently and with low maintenance. The conversion efficiency of TE materials is defined by function of the figure of merit, ZT= S2 σ / k, where S, σand k are the Seebeck coefficient, electrical conductivity, and thermal conductivity, respectively. Advances over the past decades show that special nanostructure such as nanoplates, nanotubes and nanowires and doping are the two efficient methods to increase ZT[ 1, 2, 3, 4].

On one hand, researches on nanostructured thin-film show that quantum confinement is beneficial to enhance the power factor[ 5], or to increase phonon scattering at interfaces to reduce the lattice contribution to thermal conductivity[ 6]. On the other hand, reports based on thermoelectric efficiency indicated that enhancement of ZT can be obtained by introducing metal/semimetals nanoparticles into a semiconducting matrix[ 7, 8]. For example, Zhang, et al[ 1] demonstrates that the interfacial barrier between semimetal and semiconductor is able to filter out cold carriers to enhance Seebeck coefficient without losing mobility. In a research on Cu dispersed Bi0.5Sb1.5Te3 bulk materials, Kim, et al emphasizes that Cu nanoparticles act as effective phonon scattering centers in the Bi0.5Sb1.5Te3, and the electrical conductivity increased systematically with increasing content of Cu nanoparticle[ 9].

Additionally, compared with bulk materials, ZT of low-dimensional Bi2Te3 or Sb2Te3 based materials can be significantly improved, and the values of ZT higher than the value of 2 are reported in the thin film by many groups[ 10, 11, 12, 13]. Bi2Te3 or Sb2Te3 based thin films have been elaborated by a variety of deposition techniques, such as flash evaporation (FE)[ 14], pulsed electrodeposition (PED)[ 15], magnetron sputtering[ 16], metal-organic chemical vapor deposition (MOCVD)[ 17] and molecular beam epitaxy (MBE)[ 18, 19]. Especially, high quality films with nanostructure can be obtained by MOCVD and MBE, but the lower growth rate of both two methods limits their applications in industry. Therefore, some other methods cater to the requirement in large-scale production of thermoelectric industry, such as magnetron sputtering permit much higher growth rate[ 20]. Nonetheless, there are few studies on the fabrication of Bi0.5Sb1.5Te3 thin films due to the difficulties in controlling lower carrier concentration and preferential growth with excellent nanostructure. However, nearly no Bi0.5Sb1.5Te3 thin film with controllable nanostructure has been deposited by magnetron sputtering. And the best power factor of Bi2Te3-Sb2Te3 around 10 μW/(cm•K2) was fabricated by magnetron sputtering[ 16, 21, 22].

In this study, a simple magnetron co-sputtering method is used to fabricate the Cu dispersed Bi0.5Sb1.5Te3 thin films to prepare a stable phase with good transport property.

1 Experimental

The thin films were deposited on polished aluminum nitride (AlN) substrate by co-sputtering method using a magnetron sputtering system (JGP-450a, SKY Technology Development Co., Ltd. Chinese Academy of Sciences). Before deposition, the substrate was cleaned in turn using acetone, alcohol and de-ionized water for 15 min in an ultrasonic bath. Commercial 60 mm diameter hot-pressed Bi0.5Sb1.5Te3target (99.99%) and Cu target (99.999%) (Purchased from General Research Institute for Nonferrous Metals, China) were used and the distance between targets and substrates maintains at 90 mm. The Bi0.5Sb1.5Te3 film was deposited at 400℃, 2.0 Pa and 20 W, by co-sputtering with the hot-pressed Bi0.5Sb1.5Te3 and Cu targets. Bi0.5Sb1.5Te3 target was connected to a direct current power supplier and Cu target was connected to a radio frequency power supplier. The power of Cu target was adjusted from 5 W to 50 W to deposit the film with different content of Cu. After deposition, in-situ annealing was carried out in Ar atmosphere for 40 min. Then, the samples with power of 5 W, 10 W, 20 W and 40 W were picked out and discussed in the following sections.

The X-ray diffraction (XRD) pattern of the product was taken on a Rigaku D/MAX 2200 PC automatic X-ray diffractometer with Cu Kα radiation ( λ=0.154056 nm), with operation voltage at 40 kV and current maintained at 40 mA. The morphology and composition of the thin films were analyzed by field emission scanning electron microscopy (FE-SEM) (FEI Sirion 200) equipped with energy dispersive X-ray spectroscopy (EDS). For the quantitative analysis of the different elements, five or more different regions of each sample were analyzed. Carrier concentration and mobility were characterized on thin films deposited on 10 mm × 10 mm × 0.38 mm (measured by spiral micrometer ) substrates with four-probe method using a Hall effect measurement system (ECOPIA HMS-3000). In-plane electrical conductivity ( σ) and Seebeck coefficient ( S) were simultaneously measured on thin films deposited on 5 mm × 15 mm × 0.38 mm substrates by ZEM-3 (Ulvac Riko, Inc.).

2 Results and discussion

Figure 1 shows the crystal structure of Bi0.5Sb1.5Te3 thin films dispersed with different Cu contents. The impurity of Al3.892Cu6.10808 (JCPDS 19-0010) is marked in Fig. 1. The XRD patterns are well matched with standard pattern of Bi0.5Sb1.5Te3 (JCPDS 49-1713) without any peak of Cu. Compared with the peaks of AlN, the super high intensity shows that thin films with Cu target power of 10 W and 20 W are well crystalline, and tend to oriented along the (00 l) plane. The moved peak positions of thin film with Cu target power of 40 W reveal that a mass of Cu atoms diffuse into the base structure of Bi0.5Sb1.5Te3, and affect the interplanar spacing of the crystal. This indicates that proper Cu co-sputtering power is beneficial to crystalline and preferential orientation of Bi0.5Sb1.5Te3 thin film.

Fig. 1 XRD patterns of Cu-dispersed Bi0.5Sb1.5Te3 films sputtered with different Cu target powers

Figure 2 shows the surface morphology and cross sectional view of the thin films. The shape of grains on the surface are being more regular hexagonal with the increasing Cu target sputtering power from 5 W to 20 W (Fig. 2(a), (c), (e)) and. These hexagonal grains are all about 1 μm with well crystalline, while thicknesses of the grains increase with the increasing power. These films are about 1 μm thick and stacked by tens of nanometer thick layers (Fig. 2(b), (d), (f), (h)). When the power reaches 40 W, the size of grains sharply decreases and the shapes of grains are like balls in Fig. 2(g). The cross sectional view also shows that the film is stacked by irregularly shaped grains instead of layers. The pictures indicate that the Cu atom well dispersed into the thin film, and the crystal size and shape can be affected by the increased Cu content. The SEM results about grain size and layer structure also correspond to the greatly change of peak positions and peak width as shown in XRD patterns. The result of EDS confirms that the thin films have an increasing Cu content of 1.26wt%, 3.59wt%, 6.56wt% and 18.09wt%.

Fig. 2 SEM images of the (00l) oriented Bi0.5Sb1.5Te3 films (a, b) Surface morphology and cross-sectional view of Cu-dispersed films sputtered at 5 W; (c, d) Surface morphology and cross-sectional view of Cu-dispersed films sputtered at 10 W; (e, f) Surface morphology and cross-sectional view of Cu-dispersed films sputtered at 20 W; (g, h) Surface morphology and cross-sectional view of Cu-dispersed films sputtered at 40 W

The in-plane electrical conductivities ( σ) and Seebeck coefficient of all Bi0.5Sb1.5Te3 films have been investigated at various temperatures (in Fig. 3(a, b)) using the four probes in a commercially available ZEM-3 system.

Fig. 3 The temperature-dependent thermoelectric properties for the Cu-dispersed Bi0.5Sb1.5Te3 films sputterned at different powers

The electrical conductivities of Cu-dispersed Bi0.5Sb1.5Te3 increase from 8 × 104 S/m to 16 × 104S/m with increasing Cu target power at 305 K (Fig. 3(a)). This is attributed to an increase of carrier concentration due to the effect from Cu atom as we will show next section. The electrical conductivity increases with increasing level of Cu dispersion but decreases with increasing temperature, similar to that observed with metals or degenerate semiconductors.

The electrical conductivity is corresponded with the equation, σ = ne μ, where n, μ, and e are carrier concentration, carrier mobility and electronic charge, respectively. The effective charge carrier concentration and carrier mobility investigated by the Hall effect measurement (Table 1) show that the film is p-type with an effective electron concentration ranging from 2.8×1020 cm-3to 1.8×1021 cm-3, and the carrier mobility ranging from 17.9 cm2/(V•s) to 5.2 cm2/(V•s) at 300 K. The carrier mobility does not change significantly with Cu dispersion with the sputtering power from 5 W to 20 W and sharply decreased with power of 40 W, which indicates that Cu atoms are too small to introduce charge carrier scattering with the Cu target power from 5 W to 20 W. Therefore, the electrical conductivity was increased by the Cu dispersing.

Table 1 Carrier mobility and carrier concentration of the samples sputtered at differeat powers

Temperature-dependent Seebeck coefficient of the thin films is shown in Fig. 3(b). It is decreased at room temperature by the Cu dispersing and is stable with increasing temperature. The Seebeck coefficient can be expressed as follow[ 17],

(1)

where kB is the Boltzmann constant, ris the exponent of the power function in the energy dependent relaxation time expression, and NV is the effective density of states in the valence band. Seen from Eq(1), Seebeck coefficient is mainly dependent on carrier concentration. In this case, the decrease in the Seebeck coefficient of the Cu-dispersed Bi0.5Sb1.5Te3 at room temperature is due to the increase in the carrier concentration.

Fig. 3(c) shows the power factor for the Cu dispersed Bi0.5Sb1.5Te3 thin films in the temperature range from 305 K to 415 K. The optimum power factor of Cu dispersed Bi0.5Sb1.5Te3 films is above 15 μW/(cm•K2) in the whole measuring temperature range and reaches the maximum value of 20 μW/(cm•K2) at ~355 K. The power factor is enhanced dramatically by the Cu dispersion, which is attributed mainly to the increase in electrical conductivity.

3 Conclusions

In summary, Cu-dispersed Bi0.5Sb1.5Te3 thin films have been successfully fabricated by a simple magnetron co-sputtering method and the Cu atom is well dispersed into Bi0.5Sb1.5Te3 crystal. Cu target co-sputtering is beneficial for growth of (00 l) oriented Bi0.5Sb1.5Te3 thin films. The electrical conductivity increases systematically with increasing Cu content. The power factor is enhanced over a temperature range of 305-415 K due to the high electrical conductivity and the maintenance of Seebeck conductivity, which provides the possibility of designing a material with a high electrical conductivity and acceptable Seebeck coefficient for thermoelectric application in the low temperature range.

The authors have declared that no competing interests exist.

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