Interface Structure and Electrical Property of Yb0.3Co4Sb12/Mo-Cu Element Prepared by Welding Using Ag-Cu-Zn Solder

doi:10.15541/jim20140378

Abstract

Abstract:

The barrier layer of Ti-Al and the contact layer of Ni were joined to Yb_0.3Co₄Sb₁₂ simultaneously by using spark plasma sintering (SPS) technique. The Mo-Cu electrode was then welded to thermoelectric element Yb_0.3Co₄Sb₁₂/Ti-Al/Ni by using Ag-Cu-Zn alloy as solder. SEM results show that there are no cracks at the interfaces of Yb_0.3Co₄Sb₁₂/Ti-Al/Ni/Ag-Cu-Zn/Mo-Cu thermoelectric joints. The EDS analysis shows that intermetallic compounds (IMCs) layer containing AlCo, TiCoSb and TiSb₂ phases are formed at the interface between Yb_0.3Co₄Sb₁₂ and Ti-Al. After thermal aging at 500℃ for 30 d, the inter-diffusions at both Yb_0.3Co₄Sb₁₂/Ti-Al interface and Ag-Cu-Zn/Ni interface tend to be steady. The contact electrical resistivity of the Yb_0.3Co₄Sb₁₂/ Ti-Al/Ni/Ag-Cu-Zn/Mo-Cu thermoelectric joints are about 6.1 μΩ·cm²after welding, and it maintained as low as 10 μΩ·cm² even after thermal aged for 30 d.

Key words: thermoelectric element, SPS, braze, contact electrical resistivity

CLC Number:

TN377

TANG Yun-Shan, BAI Sheng-Qiang, REN Du-Di, LIAO Jin-Cheng, ZHANG Lan-Ting, CHEN Li-Dong. Interface Structure and Electrical Property of Yb_0.3Co₄Sb₁₂/Mo-Cu Element Prepared by Welding Using Ag-Cu-Zn Solder[J]. Journal of Inorganic Materials, 2015, 30(3): 256-260.

Figures/Tables 8

Fig. 1 SEM image of Yb0.3Co4Sb12/Ti-Al/Ni cross section after SPS

Fig. 2 SEM image and line-scan EDS of Yb0.3Co4Sb12/ Ti-Al/Ni interface from A to B after SPS

Fig. 3 EDS analyses of IMC layer at Yb0.3Co4Sb12/Ti-Al interface region after SPS

Fig. 4 Electrical resistance of Yb0.3Co4Sb12/Ti-Al/Ni interface after SPS

Fig. 5 SEM images of thermoelectric elements after thermal aging at 500℃ for different period (a) 0 d; (b) 10 d; (c) 20 d; (d) 30 d

Fig. 6 Line analysis of Mo-Cu/Ag-Cu-Zn/Ni interface from C to D after thermal aging at 500℃ for 30 d

Fig. 7 Electrical resistance of thermoelectric elements after thermal aging at 500℃ for different period

Table1 Contact electrical resistivity of thermoelectric elements after thermal aging at 500℃

Time/d	0	10	20	30
Contact electrical resistivity/ (μΩ·cm²)	6.1	8.0	8.9	9.8

References 17

[1]	BANDHARI C M, ROWE D M.CRC Handbook of Thermoelectrics. USA, NewYork: CRC Press, 1995.
[2]	CRANE D T, LAGRANDEUR J W.Progress report on BSST-Led US department of energy automotive waste heat recovery program.Journal of Electronic Materials, 2010, 39(9): 2142-2148.
[3]	RADOUSKY H B, LIANG H.Energy harvesting: an integrated view of materials, devices and applications.Nanotechnology, 2012, 23(50): 1-35.
[4]	SALES B C, MANDRUS D, CHAKOUMAKOS B C, et al.Filled skutterudite antimonide: electron crystals and phonon glasses.Phys. Rev. B, 1997, 56(23): 15081-15089.
[5]	WU T, BAI SQ, SHI X, et al. Enhanced thermoelectric properties
	of BaxEuyCo4Sb12 with very high filling fraction.Journal of Inorganic Materials, 2012, 28(3): 224-228.
[6]	SALES B C, MANDRUS D, WILLIAMS R K.Filled skutterudite antimonides: a new class of thermoelectric materials.Science, 1996, 272(5266): 1325-1328.
[7]	SHI X, YANG J, SALVADOR J R, et al.Multiple-filled Skutterudites: high thermoelectric figure of merit through separately optimizing electrical and thermal transports.J. Am. Chem. Soc., 2011, 133(20): 7837-7846.
[8]	ELGENK M S, SABER H H, CAILLAT T, et al.Tests results and performance comparisons of coated and un-coated skutterudite based segmented unicouples.Energy Conversion and Management, 2006, 47(2): 174-200.
[9]	FAN J F, CHEN L D, BAI S Q, et al.Joining of Mo to CoSb3 by spark plasma sintering by inserting a Ti interlayer.Materials Letters, 2004, 58(30): 3876-3878.
[10]	JAMES R S, JUNG Y C, ZUXIN Y, et al.Thermal to electrical energy conversion of Skutterudite-based thermoelectric modules.Journal of Electronic Materials, 2013, 42(7): 1389-1399.
[11]	柏胜强, 李菲, 吴汀, 等.一种碲化铋基热电器件及其制备方法. 中国, H01L35/08, CN103413889. 2013.11.27.
[12]	ZHAO D G, LI X Y, JIANG W, et al.Fabrication of CoSb3/MoCu thermoelectric joint by one-step SPS and evaluation.Journal of Inorganic Materials, 2009, 24(3): 545-548.
[13]	ZHAO D G, LI X Y, HE L, et al.High temperature reliability evaluation of CoSb3/electrode thermoelectric joints.Intermetallics, 2009, 17(3): 136-141.
[14]	ZHAO D G, GENG H R, TENG X Y.Fabrication and reliability evaluation of CoSb3/W-Cu thermoelectric element.Journal of Alloys and Compounds, 2012, 517: 198-203.
[15]	KRZYSZTOF T W, RAFAL Z, RYSZARD M.High temperature CoSb3-Cu junctions.Microelectronics Reliability, 2011, 51(7): 1198-1202.
[16]	赵雪盈. 掺杂与复合对CoSb3基填充方钴矿材料热电性能的影响. 北京: 中国科学院研究生院博士学位论文, 2006.
[17]	DING J, LIU R H, GU H, et al.Study on the high temperature stability of YbyCo4Sb12/Yb2O3 composite thermoelectric material.Journal of Inorganic Materials, 2014, 29(2): 209-214.

Interface Structure and Electrical Property of Yb_0.3Co₄Sb₁₂/Mo-Cu Element Prepared by Welding Using Ag-Cu-Zn Solder

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